OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today released a unique thermal compound, Freeze, to their line of premium cooling products. Using the latest innovations in thermal management compounds, OCZ Freeze has higher heat conductivity potential than leading silver-based thermal pastes on the market today, offering an ultra-reliable solution for all computing environments.
Based on a proprietary formulation of thermally conductive ingredients, OCZ Freeze can lower CPU core temperature as much as ten percent when compared to conventional silver-based compounds that are a popular choice amongst enthusiasts. OCZ Freeze compound helps maximize overclocking results by reducing the thermal barrier between the CPU and cooler, giving you a performance edge during the toughest computing situations.
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